Ford has partnered with Diebold Nixdorf (DNB) to provide an alternative way to combine thin films and industry standards printed circuit boards, with plans to introduce the features by 2019. The effort represents the latest in a series of hybrid components to make driving safer and easier, and offers even greater benefits to the automotive industry with the elimination of electrical wiring, which is a growing cost and a chronic safety concern in this day and age.
Photo:Ford The new Diebold DieTechUB5 employs a Nano Film Edge, ensuring a lifespan as long as the vehicle for both connectivity and protection.
Just like a coat, layers protect from cold, damp and wet weather, and can even be used to seal cracks in a car interior. Stack several layers, even several nano-films to reach your desired thickness, and the various layers support one another. The Diebold DieTechUB5 utilizes the Thin Film Edge to support a wider range of applications, features and sizes of current Thin Film Ultraviolet (TNUV) lines.
The new Diebold DieTechUB5 employs a Nano Film Edge, ensuring a lifespan as long as the vehicle for both connectivity and protection. Unlike conventional electrical circuits, Thin Film Ultraviolet lines are thin enough to fit through the firewall in a vehicle but high enough to be protected against electrostatic discharge. Because thin films do not take up any footprint of any kind, the Diebold DieTechUB5 is easy to integrate into the frame, and can be replaced or changed without significant modification to the vehicle.
Photo:Ford For the passenger compartment, the Diebold DieTechUB5 offers a slimmer, stronger and lighter body structure.
Under the skin, the Diebold DieTechUB5 offers a slimmer, stronger and lighter body structure. Typical TNUV lines require a beefier, heavier frame and a thinner motherboard that can shorten the design life of the electrical circuit board. Customers may also experience changes in the board architecture and unusual electrical input needs as a result of the slim setup, something not even possible with the Thin Film Ultraviolet displays in some top-of-the-line Mercedes-Benz vehicles.
Photo:Ford For the interior, the Diebold DieTechUB5 provides an option to expand the processing power of the car.
New technology can also be found under the hood in the new Diebold DieTechUB5, an option to expand the processing power of the car and allow it to perform quickly and safely. The new Thin Film Ultraviolet Circuit Board (TNUV CSB) uses a wide array of small layers of materials and allows for even greater efficiency in the circuitry of a vehicle. A new semiconductor ASIC that can be used for either electrical circuits or auto-electronic control circuits. As this technology becomes more widely deployed, it will result in greater efficiency in reducing emissions and helping fuel economy.
The Thin Film Ultraviolet circuit board product will be unveiled today at the Diebold Nixdorf Battery Library at the 5th International Automotive Electronics World in Detroit, Michigan.